The Die Bonder Equipment Market is projected to grow from USD 2.23 billion in 2024 to USD 4.15 billion by 2035, registering a CAGR of 5.82% (2025–2035). Growth is driven by surging semiconductor demand, increasing automation, and the miniaturization of electronic components across industries such as automotive, consumer electronics, and telecommunications. https://industrytoday.co.uk/electrical/die-bonder-equipment-market-2025-2035-cagr-582-driving-precision-and-efficiency-in-semiconductor-packaging